Downloads for Paper, Media Coatings and Wet End Applications

EXP 4115-1: For high speed IJ and hybrid printing functionality (pdf, 1.54 MB)

Fact Sheet: HYDREX® P silicates for enhanced paper functionality (pdf, 902 KB)

Industry Brochure: AEROSIL® for Photo Inkjet Media (pdf, 2.58 MB)

The Industry Brochure "AEROSIL® for Photo Inkjet Media" gives an overview about the use of AEROSIL® fumed silica and AEROXIDE® fumed alumina in microporous photo inkjet media.

Industry Information 2243: Products for the paper and film industry (pdf, 763 KB)

Technical Information 1322: Paper Sizing with AERODISP® Fumed Silica Dispersions (pdf, 1.10 MB)

The Technical Information No. 1322 describes the new concept of Evonik of improving the inkjet print performance of uncoated office and printing paper by applying a thin fumed silica coating directly on the paper machine (size press).

Technical Information 1331: AEROSIL® Fumed Silica and AEROXIDE® Fumed Alumina for Glossy Photo Inkjet Media (pdf, 1.37 MB)

The Technical Information No. 1331 describes the entire development and production process for photo inkjet media with fumed metal oxides.

Technical Information 1357: AERODISP® Fumed Silica Dispersions as an Anti-Slip Agent for Paper Bags (pdf, 429 KB)

Paper bags require a sufficient degree of surface friction to enable stable stacking during transport of the bags.

Technical Information 1420: ZEOLEX® for decor paper applications (US) (pdf, 538 KB)

ZEOLEX® sodium aluminosilicates provide decorative laminates increased wet opacity, UV light resistance and high brightness while reducing abrasivity versus titanium dioxide (TiO2) and calcined clay.

Technical Information 1421: ZEOLEX® HYDREX® for TiO2 Extension (US) (pdf, 913 KB)

Evonik silicate solutions for the paper market are engineered to provide superior performance by improving quality and generating cost savings as a replacement for TiO2.

Technical Information 1423: HYDREX® for Board Applications (pdf, 147 KB)

Evonik silicate solutions for the paper market are providing superior performance by improving quality and generating cost savings for board applications.